Alphawave Semi proudly announced its recognition as the recipient of the TSMC 2024 OIP Partner of the Year Award for ...

SIAE MICROELETTRONICA has selected EnSilica to assist the design of Application-Specific Integrated Circuits (ASICs) for its ...

The connected world we live in today depends on billions of chips. The sheer volume of chips required for a functioning ...

EnSilica is pleased to announce that it has joined the Design Center Alliance ("DCA") of the Taiwan Semiconductor ...

Synopsys today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI ...

Nature journal publishes Pragmatic Semiconductor’s latest research article, a Bendable Non-silicon RISC-V Microprocessor, demonstrating the world’s ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

Memory has been selected as the 2024 TSMC Open Innovation Platform® (OIP) Partner of the Year for Specialty Embedded Memory ...

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE ...

At our recent SiFive Day event, SiFive’s CEO Patrick Little explained that “AI and RISC-V were made for each other.” The open RISC-V standard frees ...

Silvaco today announced that its 2024 TCAD Baseline Release simulation platform with digital twin modeling, provides support for planar CMOS, FinFET and Gate-All-Around (GAA) transistor technologies, ...

Plano, Texas, USA -- September 24, 2024-- Siemens Digital Industries Software today announced that Japan-based Preferred ...