A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...

Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...

Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. Abstract “Memory-centric computing aims to ...

A technical paper titled “Recent progress in spin-orbit torque magnetic random-access memory” was recently published by imec.

Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...

A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data ...

A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...

Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...

Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...

A new technical paper titled “Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...