The AlphaCHIP1600-IO chiplet has been purpose-built for use in SiPs (System-in-Packages) targeting these next-generation ...

Researchers are tackling key 6G challenges—from ultra-fast photonic AI for real-time RF processing to novel GaN amplifier behavior and ultra-compact phased-array packaging. Jun.

By combining ultra-wideband (UWB) positioning with inertial measurement unit (IMU) orientation sensing, MotionEngine Hex delivers true 6-degree-of-freedom (6-DOF) tracking – allowing users to control ...

Ceva’s RealSpace® Spatial Audio software is designed for low power consumption, efficient compute, and seamless integration into wireless audio devices. It delivers cinematic 3D sound with dynamic ...

Tenstorrent announced today that it has acquired Blue Cheetah Analog Design, a start-up building highly-customized analog mixed-signal IP. Blue Cheetah has been an integral vendor for Tenstorrent, ...

Codasip, the European RISC-V leader, announced today an accelerated process to sell the company. Codasip has been awarded several grants and equity funding from various bodies of the European Union ...

Advanced Professional Video, APV, CODEC is a next generation of video compression & decompression tool and key technology for prosumers who do not want to compromise on quality while enjoying the ...

In recognition of International Women in Engineering Day, the focus of this Agile Analog blog post is something close to my heart—how to encourage more women to work and progress in the semiconductor ...

Consider, for instance, the huge population of CPU and DSP architectures that existed in the year 2000. The image below shows ...

Early Software Development Without Hardware Start building and validating application software as soon as the architecture is defined. Our VECUs simulate the behavior of production ECUs, allowing ...

Today, many companies are developing multi-die systems. Some, like AMD, Intel, and Nvidia, manage the entire development ...

Intel’s announcement that is it shutting down its small automotive unit, laying off most of the team, highlights its efforts to ‘slim down’ its operations. Operating out of Munich it designs chips for ...